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金属矿山 ›› 2023, Vol. 52 ›› Issue (05): 31-44.

• “矿业青年科学家”专题 • 上一篇    下一篇

金属矿充填固化过程监测研究现状及展望

王 勇 李 健 王珍岐 那 庆 毕 成 吴爱祥
  

  1. 北京科技大学土木与资源工程学院,北京 100083
  • 出版日期:2023-05-15 发布日期:2023-06-15
  • 基金资助:
    国家自然科学基金项目(编号:52130404,51804015);中央高校基本科研业务费专项(编号:FRF-TP-19-002C2Z,QNXM20220002)。

Present Situation and Prospect of Backfilling Consolidation Process Monitoring for Metal Mine

WANG Yong LI Jian WANG Zhenqi NA Qing BI Cheng WU Aixiang #br#   

  1. School of Civil and Resource Engineering,University of Science and Technology Beijing,Beijing 100083,China
  • Online:2023-05-15 Published:2023-06-15

摘要: 充填采矿技术是金属矿绿色高质量发展的重要支撑技术,课题组在充填领域提出了“充填固化过程监 测”分支研究方向,旨在突破金属矿充填采场原位强度难以监测表征的瓶颈问题。 结合课题组相关研究进展,总结凝 练了金属矿充填固化理论与应用研究的技术思路,并从充填固化过程多场性能监测技术、多场性能演化规律、多场性 能发生机理、多场性能关联机制、充填体强度—多场性能表征模型、充填固化过程数值模拟以及工程应用等方面系统 阐述了金属矿充填固化过程多场性能监测理论和应用的研究现状。 在上述分析的基础上,从理论、技术、装置 3 个层 面展望了未来发展方向,认为后续需要攻克的重点分别为:真实采场全域数值仿真,基于固化过程监测的充填体安全 预警技术,无线化、精准化与低价化的固化过程监测传感器研制及工程推广应用。

关键词: 充填采矿, 固化过程, 多场性能, 原位性能, 未来展望

Abstract: Backfilling mining technology is an important support technology for the green and high-quality development of metal mines. The branch research direction of monitoring of backfilling solidification process in the field of filling was proposed by the research group,aiming to break the bottleneck problem of in-situ strength monitoring and characterization of metal mine stope backfilling fields. Combined with the relevant research progress of the group,the technical ideas of the theory and application of metal mine backfilling and curing research are summarized. The research status of the theory and application of multifield performance monitoring of metal mine backfilling and curing process is systematically expounded from the aspects of multi-field performance monitoring technology, multi-field performance evolution law, multi-field performance mechanism, multi-field performance correlation mechanism,backfill strength and multi-field performance characterization model,numerical simulation of backfilling and curing process,and engineering application. On the basis of the above analysis,the future development direction is foreseen from three levels:theory,technology and device,and the subsequent focus needs to be tackled as follows:real stope field-wide numerical simulation,backfill safety early warning technology based on curing process monitoring, development of wireless,accurate and low-cost curing process monitoring sensors and engineering promotion application.